Riding a record-smashing Q2 profit fueled by strong demand for 12-high HBM3E, SK hynix announced at last week’s earnings call that it will boost 2025 spending to keep pace with the expanding HBM market. While the company hasn’t disclosed the exact increase, sources told The Elec its 2025 capex i...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...

Riding strong demand for 12-high HBM3E and broad NAND growth, SK hynix smashed records in Q2, announcing a stellar 22.23 trillion won ($16.15B) in sales and 9.21 trillion won ($6.7B) in operating profit—the best quarterly results ever, according to its press release and The Korea Times. The mem...

With JEDEC unveiling the LPDDR6 standard on July 9, memory giants are racing to meet soaring demand from mobile and AI devices. Notably, according to industry sources cited by Commercial Times, DDR6 is expected to enter large-scale adoption by 2027. Leading DRAM makers, including Samsung, Micron,...

With NVIDIA said to be aiming to procure up to 800,000 SOCAMM units this year, a new battleground is emerging among the top three memory giants. U.S.-based Micron appears to be leading the charge, having reportedly started SOCAMM module production for NVIDIA. Meanwhile, Samsung and SK hynix are acti...