SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology remains premature given per...

At CES 2026, NVIDIA takes the lead with its next-generation Rubin, positioning itself as the initial, exclusive HBM4 client currently. While the AI chip giant is certainly reshaping the HBM4 landscape, TrendForce observes it has pushed per-pin speeds above 11 Gbps, forcing SK hynix, Samsung, and M...

As CES approaches, SK hynix is set to highlight its flagship next-generation memory product. According to the company’s press release, it will debut a 16-layer HBM4 with 48GB. The new offering represents the next generation of its 12-layer HBM4 (36GB), which previously demonstrated industry-leadin...

With Jensen Huang officially confirming at CES that all six of NVIDIA’s Rubin chips are back from manufacturing partners and set for a 2026 launch, the memory market is entering another fierce sprint for capacity and pricing. Samsung Electronics and SK hynix, according to Hankyung, have reportedly...

With general memory prices surging and HBM4 on the horizon, 2026 could be another landmark year for memory giants. In its New Year message released today (Jan. 5), SK hynix noted that HBM3E will remain the dominant product this year, even as HBM4 ramps up, with estimates suggesting it will account f...