Subject


SiC


2025-11-07

[News] Two New SiC Wafer Fabs Announced New Construction Phase

Mitsubishi Electric: 8-Inch SiC Wafer Fab Completed, Production Accelerating Mitsubishi Electric has announced the completion of its new 8-inch silicon carbide (SiC) power semiconductor manufacturing facility in Kikuchi, Kumamoto Prefecture, Japan. The company held an official completion ceremony...

2025-10-31

[News] SiC Shake-Up: Toshiba Drops China SICC Deal; Wolfspeed Posts Weak Results Amid Soft Demand

Toshiba recently said that the memorandum of understanding (MOU) signed by its subsidiary, Toshiba Electronic Devices & Storage Corporation, with China’s SICC in August 2025, covering collaboration on silicon carbide (SiC) power semiconductor wafers, was terminated in September 2025 after furt...

2025-09-24

[News] Huawei Released SiC Thermal Management Technology Patents

Huawei has recently disclosed two patents related to silicon carbide (SiC) thermal management technologies: “Thermal Conductive Composition and Its Preparation Method and Application” and “A Thermal Conductive and Wave-Absorbing Composition and Its Application.” The first patent outlines ...

2025-09-18

[News] South Korea Launches First 8-Inch SiC Plant in Busan, Annual Output Projected at 30K Wafers

With silicon carbide (SiC) offering superior heat resistance, voltage tolerance, and power efficiency over traditional silicon, global leaders like Infineon and Wolfspeed are racing ahead. Now, South Korea is stepping up too—Maeil Business Newspaper reports that Busan has opened the nation’s fir...

2025-09-16

[News] Silicon Carbide Battle Rekindled by Industry Giants: Wolfspeed, Samsung Make Waves

Despite intensifying competition from Chinese rivals, global chipmakers continue to accelerate their SiC investments amid the AI boom. According to Wealth Magazine, NVIDIA is reportedly planning to replace traditional silicon interposers with silicon carbide in its next-generation Rubin architecture...

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