Subject


Samsung


2025-07-23

[News] DDR6 Set for 2027 Mass Adoption as Memory Giants Reportedly Finalize Prototype Designs

With JEDEC unveiling the LPDDR6 standard on July 9, memory giants are racing to meet soaring demand from mobile and AI devices. Notably, according to industry sources cited by Commercial Times, DDR6 is expected to enter large-scale adoption by 2027. Leading DRAM makers, including Samsung, Micron,...

2025-07-23

[News] SOCAMM Ignites a New Memory War After HBM — Samsung and SK hynix Join the Race

With NVIDIA said to be aiming to procure up to 800,000 SOCAMM units this year, a new battleground is emerging among the top three memory giants. U.S.-based Micron appears to be leading the charge, having reportedly started SOCAMM module production for NVIDIA. Meanwhile, Samsung and SK hynix are acti...

2025-07-22

[News] SK hynix’s HBM4 Lead Shrinks as Rivals Close Gap Ahead of 2026 Shakeup

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

2025-07-22

[News] Samsung Display Rumored to Add New IT Sales Team for G8.6 OLED Business

Korean media outlet The Elec reported that Samsung Display underwent a restructuring on July 1, during which it added an IT Sales Team to its IT Business Division. Previously, the division only consisted of an IT Technology Team and a Development Team. The report mentioned that the establishment ...

2025-07-21

[News] Nikon Unveils DSP-100 System for Panel-Level Packaging, Supporting 600mm Panels with 9x Throughput

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

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