Amid tightening memory supply, the industry is shifting focus to high-margin, cutting-edge products catering to hyperscalers. Legacy, consumer-oriented memory is gradually reaching end-of-life, with 2026 poised as a watershed year for key players. Here’s a look at how Samsung, SK hynix, and Micron...

As AI workloads continue to grow, high-bandwidth flash (HBF) is gaining momentum, with experts forecasting earlier-than-expected commercialization. According to Sisa Journal, KAIST professor Joungho Kim—widely regarded as the “father of HBM”—indicates that Samsung Electronics and SanDisk pla...

TSMC is set to hold its earnings call on the 15th, with demand for advanced process technologies in focus. According to Commercial Times, sources say OpenAI plans to launch a self-developed AI chip, codenamed “Titan,” by the end of 2026, using TSMC’s N3 process. The report adds that a second-g...

Global 8-inch wafer capacity seems to be entering a contraction phase, driven by major foundries shifting focus to advanced nodes. TSMC began scaling back in 2025, aiming to fully close selected fabs by 2027, and Samsung appears to be following the same path, with plans to shutter its Giheung-based ...

At CES 2026, NVIDIA takes the lead with its next-generation Rubin, positioning itself as the initial, exclusive HBM4 client currently. While the AI chip giant is certainly reshaping the HBM4 landscape, TrendForce observes it has pushed per-pin speeds above 11 Gbps, forcing SK hynix, Samsung, and M...