After a year and a half of setbacks, Samsung has finally closed the gap with other memory giants. Multiple South Korean outlets, including the Korean Economic Daily and Business Korea, report that the company has cleared NVIDIA’s quality validation for its 12-high HBM3e, following its development ...

According to Chosun Biz, sources say Samsung has secured a foundry contract with IBM, one of the top five players in the data center CPU market, to produce its next-generation Power11 chip. The chip will be manufactured on Samsung’s refined 7nm (7LPP) process, and in collaboration with IBM, the co...

As Samsung accelerates the development of its Taylor plant following a $16.5 billion AI6 order from Tesla, the company is set to receive an additional boost with $250 million (about 346 billion KRW) in subsidies from the state of Texas, according to ZDNet. The move, which comes after Texas grante...

According to The Elec, citing industry sources, Samsung is outsourcing the production of photomasks — vital components in chipmaking — for the first time. As the report indicates, Samsung is said to be outsourcing lower-end photomasks for memory chips, signaling a strategy to channel resources ...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...