Subject


Samsung


2023-07-06

ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

2023-06-26

HBM and 2.5D Packaging: the Essential Backbone Behind AI Server

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

2023-06-14

Sporadic Uptick Observed in Lower-Priced DDR4 Memory Modules

DRAM Spot Market Regarding recent developments in the spot market, there have been sporadic price upticks for low-priced DDR4 products. Meanwhile, prices of DDR5 products have kept falling due to the plentiful chip supply. Unlike the contract market, the spot market has been relatively unaffected b...

2023-05-18

YMTC Raises NAND Flash Prices with the Expect of Wafer Prices to Rebound in 2H23

YMTC has officially notified a 3~5% price increase for NAND Flash in mid-May. However, the initial impact of the price hike is expected to be felt in the enterprise market, and it may take some time to reflect in the consumer spot market. The semiconductor industry is in the midst of a correction...

2023-05-11

The Sales of Smaller Size TV Products Stagnate, Resulting in China’s TV Sales Dropping 1.7% in 2023

TV sales in China hit their peak in 2019, with 44.5 million units sold, but the market experienced a sharp decline in 2020. This was due to the previous marketing strategy of lowering prices to increase sales volume no longer being effective for small and medium-sized products. In response, brands s...

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