Press Releases
In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant...
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After naming its new head for the semiconductor business in May, claiming to strengthen the company’s competitiveness in cutting-edge chips, Samsung has now disclosed its latest developments regarding AI chips. According to information from Reuters and Samsung’s press release, the company plans ...
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SK hynix, as the market leader in HBM, targets to begin mass production of its GDDR7 chips in the fourth quarter of 2024, the company said on 13th June. In the meantime, Micron also announced the launch of its GDDR7 graphics memory at Computex, which is currently being sampled. According to Anan...
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The upcoming iPhone 16 series from Apple is set to debut in the latter half of the year, and according to a report from Korean media outlet "The Elec," LG Display, a major panel manufacturer in South Korea, has secured OLED panel orders from Apple for the iPhone 16 Pro Max model, ahead of its rival...
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Starting from October, 2022, the U.S. has launched a series of export controls, targeting to limit China’s access to advanced semiconductor technologies, while tech giants including Intel, Qualcomm and NVIDIA are not allowed to ship some of their most cutting-edge chips to China. Now a new develop...