This May, we have witnessed two different approaches to the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment between semiconductor giants. Intel has secured the first batch of High-NA EUV kits from ASML, which will allegedly be used on its 18A (1.8nm) and 14A (1.4n...

According to a report from CNA, the South Korean government has announced a comprehensive support plan for the semiconductor industry, amounting to KRW 26 trillion (roughly USD 19 billion). The plan includes substantial financial support, expansion of semiconductor parks, infrastructure development...

Samsung's latest high bandwidth memory (HBM) chips have reportedly failed Nvidia's tests, while the reasons were revealed for the first time. According to the latest report by Reuters, the failure was said to be due to issues with heat and power consumption. Citing sources familiar with the matte...

SK hynix has disclosed yield details regarding the company’s 5th generation High Bandwidth Memory (HBM), HBM3e, for the first time. According to a report from the Financial Times, citing Kwon Jae-soon, the head of yield at SK hynix, the memory giant has successfully reduced the time needed for mas...

On May 21st, Samsung Electronics announced that Young Hyun Jun will take over as the head of the Device Solutions (DS) division, replacing the current leader, Kyung Kye-Hyun, who will now lead the Samsung Advanced Institute of Technology (SAIT) and the Future Business Division, overseeing the compan...