As HBM competition heats up, the world’s top three memory giants—SK hynix, Samsung, and Micron—will share the stage in Taiwan for the first time this September at the Memory Executive Summit during SEMICON Taiwan 2025, according to Commercial Times and Knews. As per SEMICON Taiwan, the su...

Micron has announced the launch of the industry’s highest-density radiation-hardened SLC NAND flash memory. The newly released 256Gb SLC NAND is Micron’s first offering within its aerospace-grade portfolio of NAND, NOR, and DRAM memory solutions and is now commercially available. It is specific...

With JEDEC unveiling the LPDDR6 standard on July 9, memory giants are racing to meet soaring demand from mobile and AI devices. Notably, according to industry sources cited by Commercial Times, DDR6 is expected to enter large-scale adoption by 2027. Leading DRAM makers, including Samsung, Micron,...

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...