As interest around Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to build—including reports linking it to a Google-MediaTek TPU—the industry is watching closely for signs of a real ramp. According to Intel’s Corporate Vice President John Pitzer, the technology is expected t...

Intel’s effort to shed non-core operations appears to be shifting, as the company now plans to retain its networking and edge (NEX) business. According to Reuters, Intel concluded after reviewing a potential sale that keeping NEX would be more advantageous. Bloomberg notes that the company believe...

Earlier in July, Intel announced plans to consolidate its chip packaging operations in Costa Rica with facilities in Vietnam and Malaysia amid operational challenges. However, facing surging demand for chip packaging, the company is now set to inject an additional RM860 million ($208 million) into M...

Buzz is building as tech giants like Google and Meta consider Intel’s EMIB advanced packaging, and Team Blue is going full throttle. ETNews reports that Intel is understood to have established its EMIB process at Amkor's Songdo K5 facility in South Korea—its first-ever move to outsource such hig...

Intel is gaining momentum, reportedly locking in major orders from tech giants amid backing from Washington and NVIDIA, boosting market confidence. According to Tom’s Hardware and Commercial Times, Apple is eyeing Intel’s 18A node for M-series chips as soon as 2027, while MediaTek is exploring E...