While Micron boosted its Q4 FY2025 revenue forecast to $11.2 billion on August 12, ZDNet and New Daily report that the company has unexpectedly become the first of the big three memory giants to hint at a full sell-out of its 2026 HBM supply. In contrast, HBM leader SK hynix has yet to make a simila...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...

Riding strong demand for 12-high HBM3E and broad NAND growth, SK hynix smashed records in Q2, announcing a stellar 22.23 trillion won ($16.15B) in sales and 9.21 trillion won ($6.7B) in operating profit—the best quarterly results ever, according to its press release and The Korea Times. The mem...

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...