Riding strong demand for 12-high HBM3E and broad NAND growth, SK hynix smashed records in Q2, announcing a stellar 22.23 trillion won ($16.15B) in sales and 9.21 trillion won ($6.7B) in operating profit—the best quarterly results ever, according to its press release and The Korea Times. The mem...

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

Fresh off its inaugural overseas Foundry Direct Connect event in Seoul last week, Intel—keen to sharpen its lead in AI chips—is reportedly teaming up with SK hynix to co-develop next-generation AI accelerators, South Korea’s Newsis reports. At the Intel AI Summit on July 1, SK hynix VP Jung...

Fueled by a nearly 50% surge in HBM sales in the third quarter of fiscal 2025, Micron posted record revenue and is now eyeing another milestone. According to ZDNet, the U.S. memory giant aims to increase its HBM market share to 23–24% by the end of 2025. Notably, Micron said in its press releas...