With NVIDIA’s green light on 12-layer HBM3e, Samsung is ramping up its push into the HBM4 race. Shortly after revealing impressive HBM4e specs with per-pin speeds exceeding 13 Gbps, the memory giant is reportedly set to unveil HBM4 at its 2025 Samsung Tech Fair, taking place October 27–31 at t...

The HBM4 race is heating up. Shortly after Micron showcased its HBM4 progress, shipping customer samples with over 2.8 TB/s bandwidth and pin speeds above 11 Gbps, Samsung unveiled impressive HBM4e details at the 2025 OCP Global Summit. According to SeDaily and TweaksTown, Samsung’s HBM4e, sla...

In a major shake-up in the AI chip market, AMD has signed a multi-year deal with OpenAI to supply next-generation AI accelerators, potentially generating tens of billions in annual revenue and giving OpenAI the option to acquire up to 10% of Team Red. The impact goes beyond the two companies: accord...

As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

With the HBM4 era on the horizon and SK hynix and Micron preparing for production ramp-up from late 2025 through 2026, it is an ideal time to explore how HBM (High Bandwidth Memory) is built, its key advantages and technologies related, and why its manufacturing complexity drives high costs. Here’...