According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...

According to Sedaily, industry sources on the 20th said the HBM4 samples Samsung supplied to NVIDIA last month have passed initial prototype and quality testing and are set to enter the “pre-production (PP)” stage by the end of this month. If they clear this final validation step, mass productio...

Market rumors suggest NVIDIA has kicked off development of its own HBM base die, sending ripples through the supply chain as it could reshape the next-generation HBM landscape. According to the Commercial Times, the chip is expected to be built on the 3nm node, with small-batch trial production sche...

While Micron boosted its Q4 FY2025 revenue forecast to $11.2 billion on August 12, ZDNet and New Daily report that the company has unexpectedly become the first of the big three memory giants to hint at a full sell-out of its 2026 HBM supply. In contrast, HBM leader SK hynix has yet to make a simila...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...