With the HBM4 era on the horizon and SK hynix and Micron preparing for production ramp-up from late 2025 through 2026, it is an ideal time to explore how HBM (High Bandwidth Memory) is built, its key advantages and technologies related, and why its manufacturing complexity drives high costs. Here’...

After another strong quarter likely to set record sales and EPS in 1Q FY26, Micron highlighted its HBM4 progress during the earnings call. The company said it has shipped customer samples boasting over 2.8TBps bandwidth and pin speeds above 11Gbps, outperforming competitors, according to ZDNet, Chos...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

SK hynix announced today that it has completed the development of HBM4 and finalized preparations for mass production—the first company in the world to do so. According to its press release, the company is now ready to deliver top-tier HBM4 to customers in line with their timelines. In its pres...

According to ZDNet, Samsung Electronics is ramping up efforts to secure production capacity for 1c DRAM as it aims to take an early lead in HBM4. Industry sources say the company plans to complete equipment investments for 1c DRAM at its Pyeongtaek Campus 4 (P4) by the first half of next year. Sa...