In a major shake-up in the AI chip market, AMD has signed a multi-year deal with OpenAI to supply next-generation AI accelerators, potentially generating tens of billions in annual revenue and giving OpenAI the option to acquire up to 10% of Team Red. The impact goes beyond the two companies: accord...

As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

With the HBM4 era on the horizon and SK hynix and Micron preparing for production ramp-up from late 2025 through 2026, it is an ideal time to explore how HBM (High Bandwidth Memory) is built, its key advantages and technologies related, and why its manufacturing complexity drives high costs. Here’...

After another strong quarter likely to set record sales and EPS in 1Q FY26, Micron highlighted its HBM4 progress during the earnings call. The company said it has shipped customer samples boasting over 2.8TBps bandwidth and pin speeds above 11Gbps, outperforming competitors, according to ZDNet, Chos...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...