Subject


HBM4


2025-01-06

[News] Samsung Reportedly Starts Trial Production of HBM4 Logic Die with In-house 4nm, Challenging SK hynix

Samsung’s turnaround in the DRAM sector certainly hinges on its progress of next-gen HBMs, and now there is a ray of hope. According to South Korean media outlet the Chosun Daily, the company has started trial production of the logic dies used in HBM4. More importantly, it has kicked off initial p...

2025-01-03

[News] SK hynix to Showcase 16-layer HBM3E Samples at CES 2025, along with eSSD, CXL Developments

South Korean memory giant SK hynix announced in late September, 2024, that it has begun mass production of the world’s first 12-layer HBM3E with 36GB. Now it seems that the company is making good progress on 16-layer products as well. According to its press release, SK hynix will showcase its 16-l...

2024-12-23

[News] Micron Plans HBM4 Mass Production in 2026, Customized HBM4E to Launch in 2027-2028

A report from TechNews, citing Tom’s Hardware, indicates that in response to the rapidly growing demand driven by AI, SK hynix, Samsung, and Micron are all accelerating the development of HBM products, and recently Micron has revealed plans for its HBM4 and HBM4E. Micron shows in its AI memory po...

2024-12-10

[News] Samsung Has Reportedly Ordered Equipment for 1c DRAM Mass Production, Paving the Way for HBM4

Though still working towards the last mile on its 12hi HBM3e qualification with NVIDIA, Samsung seems to be advancing steadily on its HBM4 roadmap. According to South Korean media outlet ZDNet, Samsung is gearing up for mass production of 1c DRAM, a critical component that will determine the company...

2024-12-04

[News] SK Hynix’s HBM4 to Use TSMC’s 3nm Base Die

The Korea Economic Daily reports that SK Hynix, a leading manufacturer of AI memory chips, plans to produce its sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process technology. These chips are slated for delivery to NVIDIA in the second half of next year. The report not...

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