As the HBM4 race heats up, earlier reports from outlets like SeDaily indicate that both Samsung Electronics and SK hynix have started delivering paid final HBM4 samples to NVIDIA. Riding the wave of strong demand, Etnews reports that Samsung plans to ramp up its HBM production capacity by 50% in 202...

As the HBM4 race accelerates, attention is turning to which supplier will secure the largest share of NVIDIA’s next-generation Rubin AI accelerator. According to SeDaily, both Samsung Electronics and SK hynix have begun delivering paid final HBM4 samples to NVIDIA—moving beyond free prototypes a...

As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

Google’s TPU is gaining traction as a strong alternative to NVIDIA, and Samsung is emerging as a beneficiary of the growing ASIC trend. According to Chosun Biz, Samsung Electronics is supplying HBM to Broadcom, the world’s largest ASIC design company, and its sixth-generation HBM (HBM4) has repo...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...