As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

Google’s TPU is gaining traction as a strong alternative to NVIDIA, and Samsung is emerging as a beneficiary of the growing ASIC trend. According to Chosun Biz, Samsung Electronics is supplying HBM to Broadcom, the world’s largest ASIC design company, and its sixth-generation HBM (HBM4) has repo...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

Samsung is reportedly in discussions with NVIDIA over next year’s HBM4 pricing, and industry attention is focused on how the final terms will be set. According to Dealsite, although Samsung reduced the price of its 12-hi HBM3E, it is internally targeting price parity with SK hynix for 12-hi HBM4, ...

Shortly after announcing its “AI Megafactory” partnership with NVIDIA, where over 50,000 Team Green’s GPUs will drive chip production, Samsung is reportedly racing to clear NVIDIA’s HBM4 qualification. According to DealSite, the South Korean memory giant aims for final certification in early...