Significant personnel changes are underway at Intel as the company shifts direction under CEO Lip-Bu Tan. According to The Wall Street Journal, Gang Duan, a longtime Intel expert in chip packaging, has left the U.S. firm to join Samsung’s components division. The report highlights Duan’s key con...

South Korean battery equipment manufacturer PNT has announced its revenue target for 2026, aiming to reach KRW 1.5 trillion, a 50% increase from KRW 1 trillion in 2024. PNT CEO JoonSup Kim stated that this goal will be driven by the company’s expansion into new business areas, such as semicondu...

The advancement of glass substrate technology has drawn significant attention across the semiconductor industry. According to a report from ETNews, industry sources on July 3 noted that Absolics—a subsidiary of SKC—is ramping up its production of glass substrates. ETNews highlights that this mov...

Amid speculation that Intel may halt promotion of its 18A process to foundry customers, another initiative is reportedly under review. According to Wccftech, citing German outlet ComputerBase, industry sources suggest that Intel is considering abandoning its glass substrate efforts. As noted by C...

According to a report from Business Korea, citing SEDaily, Samsung Electronics’ Device Solutions (DS) division has begun developing “glass interposers,” a next-generation packaging material. The goal is not only to replace the expensive silicon interposers but also to enhance performance. M...