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According to The Elec, KAIST Professor Kim Jeong-ho noted that HBF (High Bandwidth Flash)—NAND flash stacked like HBM—could become a decisive factor for the future of AI. As the report explains, HBF resembles HBM in structure, with dies stacked and linked by through-silicon vias (TSVs). The key ...
Insights
According to TrendForce's latest memory spot price trend report, regarding DRAM, suppliers continue to raise DDR4 quotes, encouraged by Nanya’s strong August revenue, but buyers show limited acceptance of the hikes. In NAND, SanDisk’s push for a 10% increase to lift market sentiment has met resi...
Insights
According to TrendForce's latest memory spot price trend report, regarding DRAM, although spot transaction volumes keep shrinking, DDR4 prices have risen more than DDR5, showing that the impact of the DDR4 EOL announcements by the three major suppliers hasn’t fully faded. In terms of NAND, supplie...
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According to TechNews, citing Tom’s Hardware and Blocks & Files, the new memory technology “UltraRAM,” which combines the advantages of DRAM and NAND, has made significant progress toward commercialization. UK-based semiconductor startup Quinas Technology, the developer of UltraRAM, has p...
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Currently, in fields such as autonomous driving, smart home systems, and industrial control, there is an increasing demand for edge-intelligent hardware to locally process real-time environmental data generated by sensors and smart devices, thereby minimizing decision latency. Neuromorphic hardware ...