According to a report by Taiwan's Economic Daily, TSMC's CoWoS advanced packaging capacity is running at full throttle. As they actively expand their production capabilities, there are reports of major customers like NVIDIA increasing their orders for AI chips. Additionally, industry giants like AMD...

According to a report by Taiwan's Commercial Times, TSMC is facing a tight supply of advanced packaging capacity, with its Taichung factory ramping up equipment support at a rapid pace. Industry insiders have disclosed that TSMC's annual production capacity for the backend CoWoS (Chip-on-Wafer-on-Su...

According to Taiwan's Economic Daily, TSMC Chairman Mark Liu stated on 9/6 that semiconductor technology development "has reached the exit of the tunnel, and there are more possibilities beyond the tunnel; we are no longer bound by the tunnel." Regarding TSMC's progress in establishing a factory ...

According to a report by Taiwan's Central News Agency, Tien Wu, CEO of the semiconductor packaging and testing giant ASE Group, believes that the semiconductor industry is experiencing ongoing inventory adjustments, with uncertainties remaining in the global economy. However, he maintains a positive...

TSMC's CoWoS advanced packaging capacity shortage is causing limitations in NVIDIA's AI chip output. Reports are emerging that NVIDIA is willing to pay a premium for alternative manufacturing capacity outside of TSMC, setting off a surge in massive overflow orders. UMC, the supplier of interposer ma...