With key parts of the EU’s landmark AI Act set to take effect as early as August, over 40 European CEOs—including chipmaking tool giant ASML and big techs Philips and Siemens—are calling for a two-year delay, warning that rushing the rollout could hurt Europe’s global competitiveness and sta...

According to South Korean media outlet ETNews, both the U.S. and Japan are actively working to introduce extreme ultraviolet (EUV) lithography equipment into public-private research institutes through government-led initiatives. In contrast, South Korea’s government-driven efforts in this area rem...

According to a report from Wccftech, an unnamed Intel director states on the investment research platform Tegus, then shared by Tech Fund on X, that future high-end chip manufacturing will rely less on advanced lithography tools and more on etching technology. As indicated by the report, the directo...

According to South Korean media outlet The Bell, Samsung Electronics and SK hynix are reportedly delaying the adoption of ASML’s high-NA EUV lithography equipment in their DRAM production, citing the steep cost of the tools and upcoming shifts in DRAM architecture. 3D DRAM Architecture Won’t ...

According to Wccftech, TSMC might delay its adoption of High-NA EUV, with the company expected to bypass the tool for its A14 process and instead continue using 0.33-NA EUV, a move revealed by Senior Vice President Kevin Zhang at the NA Technology Symposium and noted by BITS&CHIPS. Still, the...