As U.S. curbs continue to reshape supply chains, China is accelerating its push for semiconductor self-sufficiency and increasingly sourcing critical chipmaking tools from outside the U.S. According to Nikkei, imports of such equipment from Malaysia and Singapore surged in 2025, surpassing shipments...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

As the AI boom drives memory demand, semiconductor equipment makers are reaping the benefits while deepening ties with top memory producers. Applied Materials has teamed up with Micron and SK hynix to develop next-generation chips critical for AI and high-performance computing, according to Reuters....

Ahead of its upcoming earnings, U.S. chip equipment giant Applied Materials faces a $252 million hit, agreeing to settle over illegal exports of chipmaking tools to China’s top foundry, SMIC, Reuters reports. The announcement, as per Reuters, was made by the U.S. Department of Commerce on Wedne...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...