As semiconductor fabrication technologies continue to advance, the number of transistors in integrated circuits (ICs) has steadily increased. Initially, ICs contained only tens of transistors, but as technology progressed, ICs integrating hundreds of thousands of transistors enabled the realization ...

According to a report by Taiwan's Economic Daily, TSMC is set to hold its Q3 earnings conference on October 19th. The market is eagerly anticipating insights from the company's top executives on six key areas: the latest semiconductor market outlook, Q3 financial forecasts, the status of 3-nanometer...

According to a report by Taiwan's Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply chain, such as UMC and ASE G...

According to Taiwan's Business Next, as Moore's Law gradually reaches its limits, semiconductor manufacturers are transitioning from 2D to 3D chip stacking and packaging to increase transistor counts for improved performance. The final step, "packaging," has become crucial. In line with this trend, ...

According to a report by Taiwan's Commercial Times, TSMC is facing a tight supply of advanced packaging capacity, with its Taichung factory ramping up equipment support at a rapid pace. Industry insiders have disclosed that TSMC's annual production capacity for the backend CoWoS (Chip-on-Wafer-on-Su...