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2025-09-03

[News] US to End TSMC Nanjing Waiver by End-2025: Decoding the Impact on the Foundry and Supply Chain

Hot on the heels of similar moves against Samsung and SK hynix, Washington has now targeted TSMC—informing the chipmaker it will revoke the Nanjing fab’s “validated end user” (VEU) status by December 31, 2025, Bloomberg reported, citing a company statement. As Central News Agency explains...

2025-09-03

[News] San’an Announced 8-inch SiC Chip Production Line Commissioning Completed

On August 27, San’an announced on its investor relations platform that the 8-inch silicon carbide (SiC) chip production line at its Hunan Sanan Semiconductor base has officially come online. It took less than a year for Hunan San’an’s 8-inch SiC chip line to go from construction to operatio...

2025-09-03

[News] Nikon Reportedly Aims Doubled Wafer Alignment Sales by FY27 as 3D Stacking, Wafer Bonding Rise

Shortly after announcing its plan to close the Yokohama Plant, Nikon seems to double down its efforts on advanced node related chipmaking tools. According to Nikkan Shimbun, the Japanese semiconductor equipment firm aims to double sales of its wafer alignment stations—which measure wafer distortio...

2025-09-02

[News] Samsung Reportedly Plans Big September Reveal: Tri-Fold Phone, XR Headset, AI Smart Glasses

According to PCMag, citing ZDNet, sources say Samsung may unveil a tri-fold smartphone, the Project Moohan XR headset, and AI smart glasses at an Unpacked event in South Korea, possibly on September 29. Rumors of a tri-fold phone, and the Project Moohan headset, developed with Google and Qualcom...

2025-09-02

[News] Applied Materials Reportedly Flags Minimal Effect of U.S. Incentives, Offers Nuanced View on China

While TSMC, Samsung, and other semiconductor giants ramp up U.S. investments under the government’s reshoring push, chip equipment leader Applied Materials is taking a different stance. According to Wccftech and Investing.com, CFO Brice Hill noted at the Deutsche Bank Tech Conference that U.S. inc...

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