As industry buzz grows over Intel’s potential role in advanced packaging for NVIDIA’s next-gen Feynman GPUs at GTC 2026, eyes are on its EMIB (Embedded Multi-die Interconnect Bridge) technology and expanding Malaysia operations. According to The Edge Malaysia, the chipmaker’s advanced packagin...

China’s semiconductor push is gaining momentum, with the country now reportedly setting its sights on key chip materials, including photoresist. According to South China Morning Post, domestic supplier Xuzhou B&C Chemical aims to mass-produce several core photoresist materials for advanced nod...

Rising memory costs are weighing on Samsung’s smartphone business, reportedly prompting the company to discontinue its Galaxy Z Tri-Fold. According to The Dong-A Ilbo, Samsung Electronics has decided to end domestic sales of the device on March 17, roughly three months after its official launch on...

With memory and logic chip prices climbing, major players in the Multilayer Ceramic Capacitor (MLCC) market are following suit with price hikes. According to Liberty Times, citing a company client notice, Japan’s Murata Manufacturing—the world’s largest maker of passive components—has offici...

SK hynix is set to showcase its latest AI memory technologies at GTC 2026. In a press release, the company said it will present solutions designed to reduce data bottlenecks and boost performance for both AI training and inference within NVIDIA’s AI infrastructure. The exhibit will feature memory ...