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2026-07-15

[News] AR Boom Attracts New Entrants From Apparel, Home Appliances and Audio Industries

On June 30, South Korea's apparel maker WONPUNG announced that it had signed a strategic memorandum of understanding (MoU) with Silicon Valley-based Sundiode to collaborate on next-generation hybrid bonding technologies for Micro LED displays. Headquartered in Silicon Valley, Sundiode has develop...

2026-07-15

[News] Korean and Japanese Researchers Unveil New AI Memory Architectures to Address HBM Thermal Limits

Research teams from South Korea and Japan have independently proposed two novel memory integration architectures aimed at increasing memory capacity and bandwidth without further increasing the height of high-bandwidth memory (HBM) stacks. Both approaches also seek to alleviate the growing thermal c...

2026-07-14

[News] China’s Dongfang Suanxin Unveils HBM-Free 14nm AI Chip, Claims Higher Memory Bandwidth Than NVIDIA H200

A Shanghai-based semiconductor start-up is betting on a new chip architecture to overcome U.S. restrictions on advanced chipmaking technologies. According to South China Morning Post, Dongfang Suanxin has outlined an ambitious strategy to challenge NVIDIA through an alternative chip architecture. Th...

2026-07-14

[News] UMC Announces First Delivery of Mass-Produced Silicon Photonics Wafers from Singapore 12-Inch Fab

Taiwan's foundry UMC and Singapore-based silicon photonics chip designer SILITH announced on July 14 the first delivery of mass-produced silicon photonics wafers from UMC's 12-inch fab in Singapore. The milestone marks the transition of silicon photonics from development to high-volume production an...

2026-07-14

[News] SK hynix Reportedly Starts Yongin Y1 Equipment Orders, Moves Up Phase 1 Opening to Feb. 2027

As SK hynix warns that the memory supply shortfall could peak in 2027 and persist into the next decade, the company is accelerating its expansion. According to ZDNet, the memory giant has begun placing equipment orders for its Yongin Y1 fab, targeting an initial capacity boost of around 20,000 wafer...

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