Please note that this article cites information from the Chosun Daily, ETNews, and TechPowerUp. With all three leading memory giants now close to shipping HBM4, the race for next-gen HBM is intensifying, with advanced nodes taking center stage. Samsung is reportedly set to use its in-house 4nm pr...

On March 16, at the Zhongguancun Forum event on “Progress in Beijing’s Basic Research and Technological Breakthroughs,” a research team led by Professor Song Cheng from the School of Materials Science and Engineering at Tsinghua University announced a major breakthrough in next-generation magn...

Please note that this article cites information from Nikkei and Rix. As semiconductor giants like TSMC accelerate development and capacity expansion for 2.5D and 3D packaging technologies such as CoWoS, a new business opportunity is emerging for chipmaking tool companies. According to Nikkei, Jap...

Please note that this article cites information from Financial Times and Nikkei. Amid rising geopolitical uncertainty, Japan’s leading MLCC supplier is reportedly moving to decouple its rare earth supply chains between the U.S. and China. According to Financial Times, Apple supplier Murata Manufa...

Please note that this article cites information from TechNews, The Elec, and Kioxia. As memory giants restructure capacity amid tight supply, Japan’s Kioxia joins the wave, with a client notice indicating it will discontinue Thin Small Outline Package (TSOP) products, final shipments set for Ma...