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2026-07-07

[News] PC Brands Expand Chinese Memory Adoption Amid Rising Costs; Asus, MSI, and Acer Reportedly Join Trend

Rising memory and storage costs are driving PC brands to explore lower-cost component suppliers. According to Commercial Times, soaring prices for key components such as memory and SSDs have made Chinese suppliers an increasingly attractive option for PC brands looking to reduce costs. Beyond Lenovo...

2026-07-07

[News] Intel Reportedly Raises CPU Prices; Flagship Xeon Up US$1,495, Select Desktop Chips +US$30–50

Intel has raised prices for a range of its CPUs. According to Tom’s Hardware, the company confirmed on the 3rd that it had increased prices for selected consumer and server processors. An Intel spokesperson said the pricing adjustments reflect current market conditions, including rising supply cha...

2026-07-07

[News] Samsung’s 2Q Operating Profit Soars 1,810% to Record KRW 89.4T, Reportedly Surpassing NVIDIA and Apple

Amid surging DRAM and NAND prices, Samsung’s newly released second-quarter earnings guidance once again exceeded market expectations. According to the the company, cited by Hankyung, preliminary second-quarter operating profit reached KRW 89.4 trillion (US$65.6 billion), up 1,810.3% year over year...

2026-07-07

[News] Chinese Team Achieved Major Breakthrough in Carbon Nanotube CFET Architecture

Complementary field-effect transistor (CFET) technology, which vertically stacks n-type and p-type FETs, is widely regarded as the key device architecture beyond FinFETs and gate-all-around (GAA) nanosheets for boosting logic density, shortening interconnects, and reducing cell footprint. The Intern...

2026-07-07

[News] Samsung, SK hynix Reportedly Reconsider Hybrid Bonding Timeline; 16-High HBM4E May Be Earliest Adoption

Samsung Electronics and SK hynix are reportedly reconsidering when to adopt hybrid bonding for HBM. According to ZDNet, growing industry speculation suggests widespread deployment of the technology for next-generation HBM may be delayed beyond earlier expectations. Although hybrid bonding had once b...

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