Just months after rolling out HBM4 shipments in early 2026, Samsung has begun providing samples of the industry’s first 12-layer HBM4E to major global partners, according to the company’s latest press release. Given that HBM4 shares the same 1c DRAM process and 4nm base die architecture as HB...

With the ongoing development of AI computing infrastructure, demand across the high-speed optical interconnect supply chain is increasingly extending upstream to equipment vendors. On May 19, MOCVD equipment maker AIXTRON announced that it had secured multiple orders from optical communications c...

Researchers at the Advanced Semiconductor Institute of the Hangzhou International Innovation Center at Zhejiang University recently announced a major breakthrough. A team led by Professor Xiaodong Pi and Researcher Rong Wang successfully fabricated an ultra-thick silicon carbide (SiC) epitaxial film...

ByteDance, the owner of TikTok and one of China’s largest AI players, is reportedly moving into CPU development as inference demand reshapes AI infrastructure needs. According to Reuters, sources said ByteDance is developing central processing units (CPUs) to support its growing AI infrastructure ...

As chipmakers increasingly seek to reduce reliance on NVIDIA GPUs, Broadcom has attracted growing attention and is now partnering with another AI chip player. According to Asia Business Daily, FuriosaAI and Broadcom plan to jointly develop a next-generation AI chip and build large-scale AI inference...