With TSMC’s CoWoS capacity remaining constrained, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology is increasingly gaining traction as an alternative, fueling expectations for stronger demand across related components. Notably, ZDNet reports that Intel plans to...

Peking University has developed chip design tools tailored for Huawei’s new LogicFolding architecture introduced on Monday. According to South China Morning Post, researchers at the university developed a prototype EDA tool tailored for Huawei’s new Tau (τ) Scaling Law and LogicFolding architec...

Amid growing market speculation that Apple’s foldable iPhone may be facing certain production bottlenecks, including potential hinge-related challenges, the long-anticipated device still appears to be on track for a 2026 debut. According to MacRumors, citing French media outlet iPhoneSoft, accesso...

U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o�...

As market chatter points to a potential up to 15% price hike for TSMC’s 3nm node, Taiwan’s second-largest foundry UMC has also signaled plans for price increases in the second half of the year and beyond. According to Liberty Times and MoneyDJ, citing CFO Chitung Liu at UMC’s shareholder meeti...