According to official sources from Shanghai’s Songjiang District, Nixi Semiconductor Technology (Shanghai) Co., Ltd., located in the Songjiang Comprehensive Bonded Zone, has officially completed the world’s first 35-micron ultra-thin wafer process and packaging & testing production line for ...

The Iran conflict is raising concerns over the supply of key semiconductor materials. As noted by Nikkei, Middle East crisis is casting a shadow over Asia’s chip supply chain as fears grow that the de facto closure of the Strait of Hormuz could persist. Seoul is particularly concerned about helium...

As the memory shortage persists, CPU supply is also tightening. According to CRN, Intel Global Channel Chief Dave Guzzi said the chipmaker’s CPU constraints are likely affecting partners across the board, though he does not expect shortage-related price increases to approach the scale seen in memo...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

As 8-inch capacity tightens and operating costs climb, foundries are bracing for a new wave of price hikes. Following Chinese peers led by SMIC, Nexchip, the country’s third-largest foundry, announced on March 12 a 10% increase in foundry fees starting June 2026, TechNews reports. According to ...