Two months after Huawei introduced the Tau (τ) Scaling Law in May, the company on July 3 disclosed additional details on an updated version, including further implementation insights and performance-related data. Notably, the V2 version of Time Scaling Theory for Multi-Level Electronic Systems (Tau...

South Korea's leading chipmakers have begun reshaping their semiconductor materials, components, and equipment (MCE) supply chains to reduce dependence on China. According to ETNews, sources say Samsung Electronics and SK hynix are evaluating alternatives to equipment from Chinese-owned Mattson Tech...

Intel is reportedly refining its 1.4nm roadmap with a new power delivery architecture. According to ETNews, sources say the company originally planned to rely exclusively on its PowerDirect back-side power delivery network (BSPDN) for the baseline 14A node. However, Intel is now reportedly consideri...

Shortly after South Korea’s memory makers unveiled a combined 800 trillion won investment to expand capacity, Micron, according to Bloomberg and EE Times Japan, broke ground on July 4 on a ¥1.5 trillion (US$9.3 billion) expansion of its Hiroshima fab. Equipment delivery and installation are set t...

As global foundry and OSAT leaders accelerate investments in panel-level packaging for ever-larger AI chips, Chinese players are also moving into the space, now extending the push into equipment as well. Among them, Circuit Fabology Microelectronics Equipment has announced that its in-house devel...