Intel’s glass substrate ambitions appear to be moving closer to commercialization, with speculation growing over the location of its first volume production facility. According to Forbes, Rio Rancho, New Mexico, could become not only Intel’s first site for volume glass substrate manufacturing, b...

As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release. Accordi...

Another traditional Japanese industrial player may be stepping deeper into advanced semiconductor manufacturing. According to Nikkei, adhesive tape company Lintec plans to begin mass production of a dust-proof film used in cutting-edge chip production as early as 2026. The company is expected to inv...

At the 2026 International Symposium on Circuits and Systems (ISCAS), held in Shanghai on Sunday, Huawei officially introduced the Tau (τ) Scaling Law during a keynote speech titled Exploration and Practice of New Semiconductor Pathways, delivered by He Tingbo, Huawei board member and president of t...

Memory giants are focusing on process transitions rather than simply pursuing aggressive capacity expansion, as they accelerate the phase-out of legacy products and shift toward more advanced NAND offerings. According to Sisa Journal, Samsung, after beginning 8th-generation V-NAND (V8) production in...