On September 12, Japan’s Ministry of Economy, Trade and Industry (METI) announced a subsidy of up to JPY 536 billion for Micron’s DRAM plant in Hiroshima. The funding will support new plant construction, production, and R&D, with a particular focus on high-bandwidth memory (HBM) and extreme ...

India’s chip ambitions continue to take shape. Following the launch of the country’s first 3nm design center led by Renesas, ARM’s newly inaugurated Bengaluru office is reported to kick off India’s advanced 2nm chip design, according to BISinfotech and IANSlive. On September 16, Union Min...

According to Central News Agency,  concerns have arisen that TSMC’s U.S. investment could crowd out its broader plans. Market rumors suggest the company is accelerating construction of its second and third Arizona fabs while halting the second phase of its advanced packaging plant in Chiayi, Taiw...

As Samsung accelerates the development of its Taylor plant following a $16.5 billion AI6 order from Tesla, the company is set to receive an additional boost with $250 million (about 346 billion KRW) in subsidies from the state of Texas, according to ZDNet. The move, which comes after Texas grante...

According to Mydrivers, at today’s Huawei Connect 2025 conference, the company unveiled a multi-year roadmap for its Ascend AI chips, with steady releases planned through 2028. The rollout will start with the Ascend 950PR in Q1 2026 and the 950DT in Q4 2026, followed by the Ascend 960 in Q4 2027 a...