Following the departure of interim Co-CEO Michelle Johnston Holthaus, Intel is facing further senior exits. According to CRN, the company is losing its second Xeon CPU chief architect this year as CEO Lip-Bu Tan pushes to revive the data center business. The report notes that Ronak Singhal, Intel se...

Huawei-backed HiSilicon, which develops the flagship Kirin mobile APs as well as the Ascend AI chips, saw a major leadership change on September 11. According to EE Times China and Sina, Eric Xu stepped down as legal representative and chairman, with Gao Ji taking over. Several other senior executiv...

SK hynix announced today that it has completed the development of HBM4 and finalized preparations for mass production—the first company in the world to do so. According to its press release, the company is now ready to deliver top-tier HBM4 to customers in line with their timelines. In its pres...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

According to ZDNet, Samsung Electronics is ramping up efforts to secure production capacity for 1c DRAM as it aims to take an early lead in HBM4. Industry sources say the company plans to complete equipment investments for 1c DRAM at its Pyeongtaek Campus 4 (P4) by the first half of next year. Sa...