AMD may be gearing up for a comeback in the high-performance GPU arena. As per Tom’s Hardware, AMD SoC chief architect Laks Pappu recently revealed on LinkedIn that the company is developing next-generation GPUs with advanced 2.5D and 3.5D chiplet packaging. AMD’s current Radeon RX 9000 serie...

Recent reports indicate that TSMC is spearheading an initiative with equipment makers and compound semiconductor partners to explore the use of 12-inch monocrystalline silicon carbide (SiC) for thermal substrates, aiming to replace conventional alumina, sapphire, or ceramic substrates. Traditiona...

According to Bloomberg, the U.S. is reportedly weighing an annual approval plan for exports of chipmaking equipment to Samsung and SK hynix facilities in China. The measure follows the Trump administration’s decision to revoke Biden-era waivers that had granted the Korean firms indefinite clearanc...

According to Tom’s Hardware, citing Bloomberg, Qualcomm CEO Cristiano Amon said Intel’s foundry technology is not yet a viable option for the company to use as a supplier for its processors. As the report notes, the CEO added that Qualcomm will continue to rely on its current producers, TSMC and...

Amid geopolitical pressures causing H20 shipment uncertainties, NVIDIA is reportedly developing more China-focused chips and has asked Samsung to double its GDDR7 order, prompting the South Korean memory giant to boost production, according to etnews. The report indicates that the additional GDDR...