Huawei has recently disclosed two patents related to silicon carbide (SiC) thermal management technologies: “Thermal Conductive Composition and Its Preparation Method and Application” and “A Thermal Conductive and Wave-Absorbing Composition and Its Application.” The first patent outlines ...

According to Chinese media outlet Mydrivers, citing The Information, OpenAI has reportedly reached a strategic partnership with Chinese Apple device assembler Luxshare to jointly develop a groundbreaking consumer AI device. At the same time, Luxshare may not be the only Apple supplier involved. G...

Apple has recently unveiled its iPhone 17 series, featuring the A19 chip built on TSMC’s N3P process. The next-generation A20 will move into the 2nm era. According to Wccftech, citing China Times, sources say that since mobile chips are expected to enter 2nm next year, prices for 3nm “N3P” wa...

According to Nikkei, MediaTek may produce some chips at TSMC’s Arizona plants, a plan Corporate Vice President JC Hsu said is still under consideration and could involve automotive products or other “sensitive” applications. This marks the first time MediaTek has signaled plans to join TSMC...

Memory giants are preparing additional price hikes amid a shortage fueled by the AI boom. Following Samsung and Micron, SK hynix—while holding off on a formal announcement—is reportedly negotiating with customers under a policy of adjusting prices according to market conditions, according to SeD...