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2025-06-17

[News] Samsung Reportedly Clears Broadcom’s HBM3E 8-Hi Prototype Test; NVIDIA 12-Hi Still Pending

According to FETV, Samsung has reportedly passed Broadcom’s qualification test for its HBM3E 8-Hi prototype, raising the prospect of rejoining the supply chain. Multiple testing equipment sources cited in the report indicate that its improved 8-Hi product has successfully passed the verification, ...

2025-06-17

[News] U.S. Senate Proposes 30% Chip Tax Credit Despite Trump’s CHIPS Act Repeal Push

According to Bloomberg, the Senate’s draft tax bill proposes a temporary boost to the investment tax credit for semiconductor manufacturers—raising it from 25% to 30% of plant investments. The measure is aimed at encouraging chipmakers to ramp up spending on new facilities before the credit expi...

2025-06-17

[News] Huawei’s Quad-Chiplet 910D Reportedly Takes Shape with Advanced Packaging to Challenge NVIDIA

Backed by founder Ren Zhengfei’s belief that advanced packaging and stacking can keep China in the advanced chip race, Huawei has reportedly filed a patent for a quad-chiplet design—likely linked to its next-gen AI chip, the Ascend 910D, per Tom’s Hardware. The report suggests that it could...

2025-06-17

[News] India Reportedly Halts Rare Earth Exports to Japan, Aiming to Expand Domestic Processing

According to a report from Reuters, sources say India has directed state-run miner IREL to suspend a 13-year-old rare earth export agreement with Japan in order to prioritize domestic supply. The report adds that India’s Commerce Minister Piyush Goyal instructed IREL to halt exports of rare earths...

2025-06-17

[News] Coherent Unveils Breakthrough Diamond-SiC Material, Targeting AI and HPC Applications

As artificial intelligence (AI) and high-performance computing (HPC) enjoy burgeoning growth, chip power consumption is highly on the rise—making heat dissipation a critical bottleneck limiting performance and reliability. On June 13, U.S.-based Coherent announced the launch of its breakthrough di...

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