While HBM4 is only just entering mass production this year, Samsung is already looking ahead. According to ETNews, speaking at NVIDIA GTC, Hwang Sang-jun, Vice President and Head of Memory Development at Samsung Electronics, said that the base die of HBM5 will adopt Samsung Foundry’s 2nm process,...

NVIDIA’s GTC revealed plans to launch an enhanced Rubin Ultra in 2027, while its next-generation architecture, Feynman, is also coming into view for 2028. According to Commercial Times, SoIC (System on Integrated Chips) is expected to be a key technology for TSMC to meet customer design needs for ...

Fresh off unveiling its Groq 3 LPU—built on Samsung’s 4nm for high-speed inference—at GTC, NVIDIA is already eyeing its next move. Reuters reports the chip giant is preparing a China-compliant version of its Groq AI chips, aiming to navigate export curbs and re-enter the Chinese market. Acc...

As a critically important III-V compound semiconductor, indium phosphide (InP) has been widely used in cutting-edge technology fields such as optical communications, quantum-dot televisions, and space photovoltaics, thanks to its favorable bandgap, exceptionally high optoelectronic efficiency, and e...

As industry buzz grows over Intel’s potential role in advanced packaging for NVIDIA’s next-gen Feynman GPUs at GTC 2026, eyes are on its EMIB (Embedded Multi-die Interconnect Bridge) technology and expanding Malaysia operations. According to The Edge Malaysia, the chipmaker’s advanced packagin...