Please note that this article cites information from Commercial Times, Economic Daily News , Liberty Times, and MoneyDJ. NVIDIA outlined its AI roadmap at GTC 2026, doubling its 2025–2027 revenue target for the Blackwell and Rubin chips to $1 trillion, but the rise of ASICs may intensify compet...

Please note that this article cites information from Hankyung. Samsung is reportedly ramping HBM4 base die production at its foundry. According to Hankyung, sources say the company will allocate over half of its Pyeongtaek foundry capacity to in-house HBM4 base dies, rather than external clients. ...

Please note that this article cites information from the Chosun Daily, ETNews, and TechPowerUp. With all three leading memory giants now close to shipping HBM4, the race for next-gen HBM is intensifying, with advanced nodes taking center stage. Samsung is reportedly set to use its in-house 4nm pr...

On March 16, at the Zhongguancun Forum event on “Progress in Beijing’s Basic Research and Technological Breakthroughs,” a research team led by Professor Song Cheng from the School of Materials Science and Engineering at Tsinghua University announced a major breakthrough in next-generation magn...

Please note that this article cites information from Nikkei and Rix. As semiconductor giants like TSMC accelerate development and capacity expansion for 2.5D and 3D packaging technologies such as CoWoS, a new business opportunity is emerging for chipmaking tool companies. According to Nikkei, Jap...