According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...

At its July 24 earnings call, Intel warned that failure of 14A could jeopardize its advanced node business. But CEO Lip-Bu Tan and his team were also candid, sharing key updates on the product roadmap and Intel’s outlook on the growing AI market. Here’s a brief summary of Intel’s conference ca...

TSMC’s U.S. expansion has been accelerating, but its plans in Japan are reportedly facing renewed delays. According to MoneyDJ, citing Nikkan Kogyo Shimbun, the launch of TSMC’s second fab in Kumamoto could be postponed by up to a year and a half, with operations now expected to begin in the fir...

As noted by The Wall Street Journal, the Trump administration unveiled  "America's AI Action Plan" yesterday, outlining measures to help tech companies accelerate the construction of data centers for training AI models and securing sufficient power. Meanwhile, according to Commercial Times, sources...

After shocking the market with mass layoffs in mid-July, Intel delivered another bombshell during its latest earnings call. In a 10-Q filing cited by Reuters, the company warned that without major external foundry customers for its 14A process, it may be forced to abandon next-gen advanced nodes ent...