According to Chinese media outlet Mydrivers, sources say that Xiaomi’s next-generation XRING O2 will debut next year, possibly launching first with the Xiaomi 16S Pro. However, as the report indicates, like the previous XRING O1, it is still expected to be manufactured on a 3nm process rather than...

As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...

iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in s...

According to South Korea’s Maeil Business Newspaper, sources say Samsung plans to equip the base and slim Galaxy S26 models with the Exynos 2600, while the Ultra version will feature Qualcomm’s Snapdragon 8 Elite Gen 2. Samsung’s Exynos is reportedly showing a rebound in performance, accord...

According to Shanghai Securities News, China’s chip industry is reportedly seeing growth driven by AI. The report notes that among 102 A-share listed companies engaged in digital chip design, analog chip design, integrated circuit manufacturing, and IC packaging and testing, 66 posted profits in t...