Hot on the heels of the U.S. greenlighting H200 exports to China, the country’s so-called “little NVIDIA,” Moore Threads, has unveiled a new product lineup, headlined by the AI training and inference chip Huashan, aiming to challenge Team Green’s Hopper series, according to the South China M...

China is reported to have built an EUV lithography prototype by reverse-engineering older ASML tools, drawing industry attention. However, the larger concern may lie less in technological catch-up than in potential loopholes in existing export controls. According to a report from Center for a New Am...

While TSMC’s Arizona expansion races ahead, its Japan operations are moving at a slower pace, drawing close attention. Plans for Kumamoto Fab 2, however, may be shifting. A Nikkei report had suggested a move to 4nm—originally planned for 6nm and 7nm—but Mirror Media now reports a bolder plan: ...

With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...