While Micron confirmed at its earnings call that it has sampled its 192GB LP SOCAMM2, other memory leaders are ramping up their efforts. Yonhap News reports that Samsung has also developed SOCAMM2, an LPDDR-based server memory module, and has already delivered samples to AI powerhouse NVIDIA, with s...

China’s long journey toward domestic EUV lithography capability appears to be narrowing, as recent developments point to faster-than-expected progress. According to Reuters, sources say China has assembled a prototype EUV machine using components sourced from older ASML systems. As the report i...

Amid tight supply across both mainstream products and high-end memory such as HBM, Micron sailed through its latest earnings call, posting record results across the board. The company said its 1QFY26 (ended November 27) total revenue—spanning DRAM, NAND, HBM, data center, and every business unit�...

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

As AI demand accelerates, companies are ramping up efforts to address rising AI-server power needs. According to MoneyDJ, citing Nikkei, Murata Manufacturing plans to begin mass production of power modules for AI servers in 2026. The company is coordinating with hyperscalers and expects to generate ...