According to TechNews, TrendForce notes that the rise of AI applications has greatly increased the need for high-speed optical communications. The industry is now centered on three expansion models for AI server and data center architectures—Scale Up, Scale Out, and Scale Across. Among these, the ...

According to Tom’s Hardware, citing Cosmos, Johns Hopkins University researchers have proposed “beyond-EUV (B-EUV),” a step beyond today’s industry-standard EUV lithography. The method employs 6.5–6.7nm soft X-ray lasers, which the report notes could enable resolutions down to 5nm and belo...

Ahead of a scheduled call between U.S. President Donald Trump and Chinese President Xi Jinping on TikTok and trade issues, China’s rare-earth exports surged to a record 7,338 tons in August, Bloomberg reports, citing customs data. As per Bloomberg, the surge marks the highest monthly level for ...

As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France to advance next-generation PLP technology, with...

According to Commercial Times, the global memory market continues to see price increases, driven by urgent orders from generative AI and major cloud service providers (CSPs). Industry sources note that both DDR4 and DDR5 contract and spot prices are set to post double-digit gains in October. The rep...