As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

According to ZDNet, Samsung Electronics is ramping up efforts to secure production capacity for 1c DRAM as it aims to take an early lead in HBM4. Industry sources say the company plans to complete equipment investments for 1c DRAM at its Pyeongtaek Campus 4 (P4) by the first half of next year. Sa...

Following its June announcement to invest roughly $200 billion in U.S. manufacturing, Micron has taken a major step toward building its new New York plant. Syracuse.com reported that, for the first time, the memory giant has submitted a detailed site plan to the town of Clay for its proposed chipmak...

While HBM rides the AI boom with DRAM giants Samsung and SK hynix accelerating the HBM4 rollout, NAND is set to follow suit. According to Nikkei, Japan’s Kioxia, in partnership with NVIDIA, plans to commercialize SSDs by 2027 with nearly 100x faster read speeds than current models. The report h...

According to Commercial Times, citing The Korea Economic Daily, South Korea — once a leader in semiconductor technology — is now confronting the rapid rise of China, particularly in chipmaking equipment and EDA. The report notes that China’s top equipment maker Naura recorded first-half operat...