Rumors swirl around AMD's upcoming chip architecture, codenamed "Prometheus," featuring the Zen 5C core. As reported by TechNews, the chip is poised to leverage both TSMC's 3nm and Samsung's 4nm processes simultaneously, marking a shift in the competitive landscape from process nodes, yield, and cos...

On August 7th, HuaHong Group officially went public on the Sci-Tech Innovation Board Market, Shanghai Stock Exchange (STAR Market, SSE). Combined with the return of SMIC to A-shares (China’s domestic shares) in the past two years and Nexchip's listing in May, it brings together the three major pla...

Mature process foundries are locked in a battle to uphold a 60% capacity utilization rate. Reports indicate that major players, including UMC, Vanguard International Semiconductor (VIS), and PSMC, are slashing prices significantly for the first quarter of the coming year to salvage their capacity ut...

Mainland China's 3D NAND flash memory manufacturer, Yangtze Memory Technologies Co. (YMTC), filed a lawsuit against the U.S. memory chip leader, Micron Technology, on November 9th in the Northern District Court of California. The lawsuit accuses Micron of infringing upon eight of YMTC's U.S. patents...

The demand for TSMC's CoWoS advanced packaging is skyrocketing. Following NVIDIA's expansion confirmation in October, there are reports in the industry that major clients like Apple, AMD, Broadcom, Marvell, and others are also placing additional orders with TSMC. To meet the demands of these five...