As interest around Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to build—including reports linking it to a Google-MediaTek TPU—the industry is watching closely for signs of a real ramp. According to Intel’s Corporate Vice President John Pitzer, the technology is expected t...

Innoscience announced that the U.S. International Trade Commission ruled in favor of the company and against Infineon Technologies in a section 337 (patent infringement) investigation that was brought by Infineon against the Chinese GaN giant. The court ruled that Infineon’s U.S. Patent No. 9,070...

Recently, PSR Semi, based in Jiangsu China, announced the successful closing of a Series A funding round worth RMB several hundred million. The round was led by prominent investors including Yongxin Fangzhou, Jinyuan Capital, and Hefei Industry Investment, among others. Headquartered in Wuxi, PSR...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

As 2025 draws to a close, tech giants are rapidly reshuffling their organizations. After Samsung reinstated its dual-CEO structure and elevated Roh Tae-moon, SK hynix followed on the 4th with a major move of its own—launching a dedicated HBM taskforce to accelerate its AI-memory push, according to...