One of NVIDIA’s major challenges currently may be convincing the market that it is capable of sustaining the rapid growth, as the largest company in the world by market cap fails to impress the investors with its fourth-quarter guidance. One of the main concerns lying ahead for NVIDIA, obviously, ...

Apple is anticipated to release its lightest and thinnest smartphone, the iPhone 17 Air, next year, featuring the A19 chip, according to MacRumors. Industry sources cited by Economic Daily News reveal that TSMC will likely remain Apple’s exclusive supplier for high-end processors. TSMC’s 3nm pro...

Is the thinner iPhone in history on the road? Apple Insider suggests that Apple’s new iPhone 17 lineup may debut a redesigned model with a remarkable thickness of just 6mm. Industry analysts cited by another report from the Economic Daily News are optimistic that TSMC will remain the sole processo...

On November 13, at Semicon Europe 2024 in Munich, Germany, China's silicon carbide (SiC) substrate manufacturer, SICC, announced the launch of the industry's first 300mm (12-inch) silicon carbide substrate. This marks a significant step into the era of ultra-large silicon carbide substrates. SICC...

According to a report by the South China Morning Post, Beijing plans to invest 33 billion yuan (US$4.6 billion) in building a 12-inch wafer fabrication facility. The initiative, spearheaded by state-owned enterprises and funds, represents a significant step in China’s efforts to strengthen its dom...