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IC Manufacturing, Package&Test


2023-12-15

[News] Rumors Suggest TSMC’s 2nm Node First Tool-In with Monthly Production Capacity Unveiled

IC Manufacturing, Package&Test

Despite the uncertainties in the semiconductor market, there is still an intense global competition in the development of advanced semiconductor manufacturing processes. TSMC as one of the key players in the foundry industry is actively advancing its next-generation 2nm process. According to market ...

2023-12-15

TrendForce’s First Seminar in Japan, Spotlights TSMC, Rapidus and Japanese Semiconductor Revitalization

IC Manufacturing, Package&Test

As the Japanese government injects substantial funds to revitalize its semiconductor industry, the dynamics of the Japanese semiconductor industry have been a global focus. TrendForce, during this year's SEMICON Japan, organized its first overseas industry-focused information seminar, delving into t...

2023-12-14

[News] Global Photoresist Prices Are on the Rise, Posing Challenges for the Semiconductor Industry

IC Manufacturing, Package&Test

Due to escalating raw material and labor expenses, The Elec reported that Dongwoo Fine-Chemistry, a subsidiary of Japan's Sumitomo Chemical, plans to increase the prices of KrF and L-line photoresists for South Korean semiconductor companies. Price increases vary depending on the type of offering, r...

2023-12-12

[News] Nvidia CEO Visits Vietnam, Plans to Establish Chip R&D Base

IC Manufacturing, Package&Test

Nvidia CEO Jensen Huang announced on the 11th the company's intention to deepen collaboration with high-tech companies in Vietnam, with a focus on fostering local expertise in AI and digital infrastructure development. Huang revealed plans to establish a chip center in Vietnam, as reported by Reuter...

2023-12-07

[News] Samsung Boosts 2.5D Packaging Equipment to Compete for TSMC’s CoWoS Orders

IC Manufacturing, Package&Test

Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

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