Subject


IC Manufacturing, Package&Test


Young Hyun Jun Vice Chairman and Head of Device Solutions (DS) Division
2024-11-27

[News] Samsung Reshuffles Leadership: New Semiconductor Chief, Foundry CTO Role Added

IC Manufacturing, Package&Test

Samsung Electronics unveiled its year-end leadership reshuffle on November 27, aiming to drive the company's next phase of growth and bolster its future competitiveness, with a strong focus on the semiconductor business. Jeon Young-hyun, who was appointed head of the Device Solutions (DS) divisio...

2024-11-26

[News] Qualcomm’s Interest in Acquiring Intel Reportedly Fades due to the Deal’s Complexity

IC Manufacturing, Package&Test

Is one of the largest purchases in the tech industry turning into a mirage? According to the latest report by Bloomberg, Qualcomm's interest in acquiring Intel has waned, as the challenges involved in acquiring the entirety of Intel have made the deal less appealing to the U.S. chip giant. Howeve...

2024-11-26

[News] SUMCO: Business with Key Memory Client Hit Hard by China’s Local Silicon Wafer Trend

IC Manufacturing, Package&Test

Often regarded as an industry disruptor in memory and chip making, China is challenging major players in South Korea and Taiwan with the emergence of Semiconductor Manufacturing International Corp. (SMIC) and NAND-focused Yangtze Memory Technologies Corp. (YMTC). However, with the support of governm...

2024-11-26

[News] TSMC Kaohsiung 2nm Fab Moves In, Apple and AMD Expected as First Customers

IC Manufacturing, Package&Test

According to Economic Daily News, TSMC’s new 2nm fab in Kaohsiung marked a significant milestone today with its equipment installation ceremony, achieving three notable records. First, it represents TSMC's inaugural 12-inch fab in Kaohsiung, preparing for mass production in 2025. Second, the equip...

2024-11-26

[News] TSMC Is On Track for A16 Mass Production in Late 2026 with Advanced Backside Power Delivery

IC Manufacturing, Package&Test

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Ecosystem Forum, TSMC announced that it is on track to begin mass production of the first chips using its A16 (1.6nm-class) process technology by the end of 2026. The report notes that the...

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