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IC Manufacturing, Package&Test


2025-04-09

[News] TSMC Could Face $1B+ Penalty in U.S. Probe over Chips Tied to Huawei’s Ascend 910B

IC Manufacturing, Package&Test

Following the U.S. Commerce Department's late 2024 investigation into whether TSMC produced AI chips for Huawei, the latest development suggests the foundry giant could face a penalty exceeding $1 billion, as per Reuters. The report suggests that the probe is linked to a chip TSMC produced for Ch...

2025-04-03

[News] Kaynes Semicon to Achieve Major Milestone with India’s First Packaged Chip in July 2025

IC Manufacturing, Package&Test

According to a report from The Economic Times, Indian company Kaynes Semicon is set to deliver the country’s first packaged semiconductor chip in July 2025. As the report highlights, Kaynes CEO Raghu Panicker has confirmed the timeline. It also states that the pilot line is “almost” comple...

2025-04-02

[News] Mature Node Shake-up? GlobalFoundries Reportedly Seeks Taiwan’s Approval for UMC Merger

IC Manufacturing, Package&Test

As TSMC and Intel push sub-2nm advances, GlobalFoundries and UMC are rumored to be joining forces in mature nodes to counter rising Chinese rivals. UMC had stated that there is currently no merger in progress, but according to Economic Daily News, insiders say GlobalFoundries has already sought appr...

2025-04-01

[News] UMC Denies GlobalFoundries Merger Rumors Amid U.S. Manufacturing Push, China Competition

IC Manufacturing, Package&Test

While TSMC makes strides in cutting-edge nodes and aims for 2nm mass production by year-end, its Taiwanese foundry counterpart, UMC, is rumored to be exploring a potential merger with U.S.-based GlobalFoundries, as per Nikkei and Reuters. However, the speculation has been denied by UMC, as it sta...

2025-04-01

[News] Japanese Firm Ajinomoto to Invest JPY 25 Billion by 2030 to Expand ABF Production for Advanced Packaging

IC Manufacturing, Package&Test

According to a TechNews report citing Nikkei, Japanese food and biotech company Ajinomoto plans to invest at least JPY 25 billion (approximately USD 166 million) by 2030 to boost production capacity of Ajinomoto Build-up Film (ABF)—a key material used in semiconductor substrates—by 50%. As th...

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